Semicon Plating Process Engineer

Job Responsibilities Lead the development and optimization of Solder Plating and Nickel Plating processes in collaboration with the R&D team. Establish and sustain high-volume manufacturing capabilities for solder and nickel plating processes. Develop and qualify new process recipes for each new device. Perform process characterization including bump dimensions, bump shear strength, and void analysis. Monitor and control process parameters such as bath concentration, lifespan, condition (Solder/Nickel/Cu), plating uniformity, and overall plating quality. Serve as backup support for Cu plating processes (IPD and RDL), including new device characterization and chemical bath monitoring. Collaborate with the Solder Reflow Engineer to develop and optimize flux coating and solder reflow processes for plated solder bumps. Create new recipes for flux coating and reflow. Conduct characterization for various bump dimensions and solder/nickel compositions, including flux coverage/height, bump geometry, shear strength, void performance, and visual appearance. Lead and drive cost reduction and quality improvement initiatives. Requirements Bachelor’s Degree in Chemistry, Chemical Engineering, or a related field. Minimum 2 years of relevant experience in solder plating, nickel plating, wafer bumping, or wafer fabrication (preferred). Working knowledge of Statistical Process Control (SPC) and JMP software. All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits. Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating 1) Current Drawn 2) Expecting Salary 3) Date Available 4) Reason to Leave each job: We regret that only shortlisted candidates will be notified Joyce Koh Ai Leng People Profilers Pte Ltd 20 Cecil St, #08-09, PLUS Building, Singapore 049705 Tel: 6950 9737 www.peopleprofilers.com EA License Number: 02C4944 EA Personnel Reg nos R1110618 Job ID: