Field Application Engineer

Our client is a world-class electronic circuit solution provider with over 35 years of history and global operations. As a trusted partner to leading communications, automotive, and medical equipment brands, they continues to drive innovation in PCB and advanced packaging substrate technology . To support our expansion in the U.S. market, we are looking to onboard a Field Application Engineer with deep knowledge of packaging substrates to work remotely from California . Location: Remote (must be based near or in California) Employment Type: Full-time Industry: Semiconductor / PCB / Packaging Substrate Languages: English Compensation: $100,000–$150,000/year (based on experience) 🛠️ Responsibilities: 🔍 Research and identify customer development opportunities across the United States 🤝 Serve as the technical point of contact for customers, supporting product demand analysis and technical communication 📊 Analyze industry trends, product evolution, and customer feedback to guide development strategies 🎯 Collect and interpret competitor intelligence to benchmark and position our offerings effectively 🎫 Support the planning and participation in relevant trade shows and product exhibitions in the U.S. 🌐 Build and expand customer acquisition channels to boost U.S. market penetration ✅ Requirements: 🧪 5+ years of experience in the packaging substrate industry — with background in process engineering, product development, or technical support 🗂️ Hands-on knowledge of customer engagement and technical requirement management in advanced PCB or packaging substrate companies 📍 Must be based in the United States with permanent residency or equivalent legal work status 🧠 Proactive, self-driven, and confident in handling external communication with U.S. clients 🤝 Strong interpersonal skills with the ability to interface effectively with R&D and sales teams in China This is a unique opportunity to be a key bridge between U.S. customers and one of Asia’s most respected circuit solution providers . If you're ready to leverage your technical expertise and industry insights to shape future innovation — apply now ! #FieldApplicationEngineer #PCBJobs #PackagingSubstrate #RemoteJobsUSA #ElectronicsCareers #SemiconductorIndustry #TechJobsCalifornia #ChineseTechGlobal

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Job ID: 10365925 / Ref: 6a4b45f0ba864fbd05d8584f6b123178

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